Not ‘just assembly’: The high-tech reality of India’s semiconductor packaging and testing sector
Raju Das
September 22, 2026
The recent momentum following Semicon India 2026 has been met with a familiar wave of digital cynicism, with critics dismissing chip packaging as mere “screwdriver technology.” This profound misunderstanding ignores the staggering complexity of modern electronics. From picosecond automated testing to thermal encapsulation, explore why Assembly, Testing, Marking, and Packaging (ATMP) is a deeply complex, non-negotiable pillar of global technology.
